Evaluation and Revision of the Chips Act ("Chips Act 2.0")

209 submissions in the snapshot (181 from organisations), portal total 209. Feedback list on the portal.

181 of 181 organisation submissions analysed; the model reads them as: supports 24 wants changes 123 34 held back for review (low confidence).

• UPV/EHU Academic or research institution, ESP model reads as: supports source
• KTH Royal Institute of Technology Academic or research institution, SWE; register: Academic institutions model reads as: supports source
  • Expand education and coordinated European training initiatives, partnered with industry, to address the severe semiconductor skills gap across design, manufacturing, testing, and AI-hardware areas.

    KTH calls for expanded education, coordinated European training initiatives, industry partnerships, and talent-attraction measures to ensure a skilled workforce across design, manufacturing, testing, and emerging areas such as AI-hardware.

  • Provide coordinated industrial demand and long-term investment in low-TRL frontier research with cross-disciplinary collaboration in materials, chip design, photonics, packaging, and power electronics, including flexible pilot lines and first-of-a-kind production facilities.

    Europe needs coordinated industrial demand, long-term investment in low-TRL frontier research, cross-disciplinary collaboration in areas such as materials, chip design, photonics, packaging, and power electronics, as well as flexible pilot lines and first-of-a-kind production facilities.

  • Ensure long-term stability in research funding, sustainable semiconductor production, accessible infrastructures for SMEs and startups, and maintain a balanced approach to security and international collaboration.

    KTH also stresses the need for long-term stability in research funding, sustainable and energy-efficient semiconductor production, accessible infrastructures for SMEs and startups, and a balanced approach to security and international collaboration.

• Technology Industries of Finland Business association, FIN; register: Trade and business associations model reads as: wants changes source
  • Create a dedicated semiconductor budget of critical mass under the next MFF within the European Competitiveness Fund aligned with national and private funding.

    Create a dedicated semiconductor budget of critical mass under the next MFF within the European Competitiveness Fund and align it with national and private funding.

  • Launch a semiconductor stream under the EU Tech Frontrunners model to fund company-led programmes with SMEs, startups and research partners.

    Launch a semiconductor stream under the EU Tech Frontrunners model to fund company-led programmes with SMEs, startups and research partners.

  • Reinforce the European Semiconductor Board with real coordinating powers and a consolidated view of EU and national investments.

    Reinforce the European Semiconductor Board with real coordinating powers and a consolidated view of EU and national investments.

• Techno-Service S.A. Company, POL; register: Companies & groups model reads as: wants changes source
  • Formally expand the definitions and scope of support under the European Chips Act 2 to explicitly include Advanced Printed Circuit Board manufacturing industry.

    TS PCB urges the European Commission and the co-legislators to formally expand the definitions and scope of support under the European Chips Act 2 to explicitly include the Advanced Printed Circuit Board manufacturing industry.

  • Recognize PCB manufacturing facilities producing advanced substrates as strategic, 'first-of-a-kind' enablers of the European electronics ecosystem.

    PCB manufacturing facilities producing advanced substrates are recognized as strategic, 'first-of-a-kind' enablers of the European electronics ecosystem.

  • Make funding and regulatory mechanisms available to stimulate R&D and significant capacity expansion in complex, high-reliability PCB technologies within the EU.

    Funding and regulatory mechanisms are available to stimulate R&D and significant capacity expansion in complex, high-reliability PCB technologies within the EU.

• Aktantis Business association, FRA model reads as: wants changes source
  • Replace the decentralized national subsidy model with EU-centralized funding and expertise for semiconductor initiatives.

    The next initiative should be mastered by EU funds with EU centralised expertise and with a large amount of funding.

  • Expand funding scope to cover front-end and back-end production, mature and advanced nodes, and both digital and analog/discrete chips.

    The areas of funding should be on front-end AND back end, on mature AND advanced nodes, on digital AND analog/discrete chips.

  • Establish a strong demand-side program to support SMEs in developing ASICs and chips.

    A strong program on the demand side should be put in place to help SMEs to develop ASIC or chips.

• Aledia Company, FRA model reads as: supports source
  • Include a strategic focus on innovative optoelectronic technologies for high-performance computing dedicated to artificial intelligence in the Chips Act 2.0 initiative.

    As part of the Chips Act 2.0 initiative, we propose the inclusion of a strategic focus on innovative optoelectronic technologies for high-performance computing architectures dedicated to artificial intelligence.

  • Support development of ultra-fast MicroLED arrays capable of transmitting data optically between critical components such as GPUs and HBM modules in inter-chip configurations.

    Aledia, a European pioneer in 3D MicroLEDs based on nanowires on silicon, aims to develop ultra-fast MicroLED arrays capable of transmitting data optically at very high frequencies between critical components such as GPUs and HBM modules in inter-chip configurations.

  • Support replacing or complementing traditional electrical interconnects with optoelectronic solutions to optimize bandwidth, latency, and energy efficiency.

    This approach seeks to replace or complement traditional electrical interconnects within packages or boards, optimizing bandwidth, latency, and energy efficiency.

• GROUP ACB Company, BEL model reads as: wants changes source
  • PCBs and PCBAs should be included in the scope of the Chips Act 2.0.

    Their inclusion in the Chips Act 2.0 is not only logical but also essential for creating a robust, self-sustaining electronic supply chain within the EU.

  • Introduce incentives for European PCB and PCBA manufacturers to encourage local production and reduce dependency on foreign suppliers.

    Incentives for European PCB and PCBA manufacturers should be introduced to encourage local production, reduce costs, and ensure that European companies are not dependent on foreign suppliers for these critical components.

  • Allocate funds through the Chips Act 2.0 for research into next-generation PCB and PCBA technologies.

    Through the Chips Act 2.0, the EU should also further allocate funds for research into next-generation PCB and PCBA technologies, such as HDI, high-frequency, flexible, and eco-friendly boards.

• NCAB GROUP AB Business association, SWE model reads as: wants changes source
  • Chips Act 2 must include materials, equipment, design and manufacturing of IC substrates, Interposers and Ultra HDI PCBs in its scope.

    the Chips Act 2 must include materials, equipment, design and manufacturing of IC substrates, Interposers and Ultra HDI PCBs

  • Without inclusion of these processes and products, the Chips Act 2 will fail to achieve its objectives.

    Without these processes and products Chips Act 2 will fail

• Micro company, ITA Company, ITA model reads as: wants changes source
  • Extend the Chips Act framework to include support for PCB production and the entire electronics supply chain.

    We therefore call for the Chips Act to be extended to include changes that could also bring about a restocking of European PCBs companies.

    machine translation by the Commission, original in IT
  • Eliminate customs duties on basic materials used for PCB production.

    The elimination of customs duties on basic materials used for the production of PCBs at least as long as these materials can also be produced again in Europe

    machine translation by the Commission, original in IT
  • Provide the same attention, facilitation and support to PCB companies as the Chips Act provides to semiconductor companies.

    Obviously, the same attention and facilitation as the Chips Act addresses semiconductor companies, will also have to be directed towards existing and new PCBs companies.

    machine translation by the Commission, original in IT
• DIGITALEUROPE Business association, BEL; register: Trade and business associations model reads as: supports source
  • Establish a centralised EU financing instrument for strategic semiconductor projects to boost competitiveness and security

    a centralised EU financing instrument for strategic semiconductor projects is essential to boost the EUs future competitiveness and security.

  • Focus EU investment on sectors where Europe already holds competitive advantage or can realistically catch up

    Europe should invest where it already holds a competitive edge or can realistically catch up.

  • Build reliable global partnerships to secure access to critical semiconductor technologies where Europe cannot compete directly

    Where direct competition with global market leaders is not viable, the EU should build reliable partnerships globally to secure access to key semiconductor technologies and supplies.

• DSI Aerospace GmbH Company, DEU model reads as: wants changes source
  • Expand the scope of the EU Chips Act to include the PCB and PCBA sector covering production, assembly, testing, and system integration.

    DSI Aerospace supports the EU Chips Act and proposes the outlined expansion of its scope to secure Europes supply resilience and technological independence.

  • Adopt a holistic approach addressing the entire value chain from semiconductor design to system integration rather than semiconductors alone.

    To truly strengthen Europes position in electronics, we need a holistic approach that covers the entire value chain from semiconductor design and manufacturing to PCB production, assembly, testing, and system integration.

  • Support Europe's scaling up and development of capabilities in advanced, high-density PCB technologies to reduce dependence on Asian manufacturers.

    Europe, on the other hand, still struggles to scale up and compete in advanced, high-density PCB technologies.

• University of Bath Academic or research institution, GBR model reads as: supports source
  • Ensure continued support for Europractice and ChipsJU programmes.

    It is vital that this effort continues to be supported.

  • Maintain Europe's competitive edge in semiconductor and advanced technology research.

    There has never been a more important time to ensure that Europe maintains its competitive edge

  • Enable training of next generations of technical personnel for technological industries.

    enable European researchers, SMEs, innovators and partners to able to train the next generations of key technical personnel for technological industries

• Politecnico di Torino Academic or research institution, ITA model reads as: supports source
  • Establish further European initiatives to support chip design as essential for sustaining innovation in this strategic domain.

    further European initiatives aimed at supporting chip design are essential to sustain innovation in this strategic domain

  • Provide sustained support to maintain European competitiveness and enable universities, research centers, and SMEs to innovate and train next-generation chip designers.

    sustained support is essential for maintaining European competitiveness, enabling universities, research centers, and small and medium-sized enterprises to innovate, and helping train the next generation of chip designers

  • Ensure continued investment in multi-project wafer access, open-source and professional EDA tools, and advanced-node availability to strengthen Europe's semiconductor strategic autonomy.

    Continued investment in multi-project wafer access, open-source and professional EDA tools, and advanced-node availability would significantly strengthen Europes strategic autonomy in semiconductors

• CIRLY Company, FRA model reads as: wants changes source
  • Ensure that the Chips Act 2 offers a comprehensive vision of the semiconductor sector aligned with ground reality.

    While we support the objectives of the Chips Act, we are concerned that it does not offer a comprehensive vision of the sector that would allow a plan to be put in place in line with the reality on the ground.

    machine translation by the Commission, original in FR
  • Fully integrate the critical situation of PCB manufacturing in Europe into the Chips Act 2.

    the catastrophic situation of PCB in Europe should be a major concern for our electronics industry and should be fully integrated into the Chips Act 2.

    machine translation by the Commission, original in FR
  • Urgently take into account industry contributions regarding PCB integration.

    We agree with all the comments already drafted to this effect and hope that these contributions will be taken into account as a matter of urgency.

    machine translation by the Commission, original in FR
• CNES Company, FRA model reads as: wants changes source
  • Include PCB and PCBA industries in the scope of the EU Chips Act 2.0.

    Nevertheless, these efforts must now be extended to PCB and PCBA industry (chips dont float).

  • Prioritize PCB and assembly industry sectors in the EU Chips Act 2.0 action plans.

    It is therefore essential to include thoses sectors in the action plans priorities.

  • Support European PCB and assembly industry development to address thermal and mechanical management challenges for advanced components.

    But the increasing power dissipation and density of I/Os in new strategic components induce a need for improving the thermal and mechanical management in the assembly of packages to PCBs.

• GdR SOC2 (CNRS) Academic or research institution, FRA model reads as: supports source
  • Adopt a comprehensive, integrated vision spanning the entire semiconductor value chain grounded in principles of low power consumption, environmental responsibility, and anti-obsolescence.

    Europe must urgently adopt a comprehensive, integrated vision spanning the entire semiconductor value chain - from breakthrough materials and device innovation, through circuits and architectures, to the full design ecosystem including simulation, synthesis, and compilation tools. This vision must be truly holistic, grounded in principles of low power consumption, environmental responsibility, and anti-obsolescence, to ensure a sustainable future for Europes semiconductor industry.

  • Fund and coordinate three pan-European flagship programs - European Chiplet Initiative, European GPU Initiative, and European EDA Initiative - to close strategic gaps and secure Europe's autonomy.

    We propose Chips Act 2 fund and coordinate three pan-European flagship programs to secure Europes strategic autonomy: European Chiplet Initiative: Chiplets - modular, high-function semiconductor building blocks - overcome the limits of monolithic design by enabling scaling, yield enhancement, and flexible manufacturing.

  • Extend the Design Platform to emphasize system and design-technology co-optimization with robust IP-protected approaches ensuring global competitiveness.

    The EU must extend the Design Platform to emphasize system and design-technology co-optimization with robust IP-protected approaches ensuring global competitiveness.

• Leibniz University Hannover Academic or research institution, DEU model reads as: wants changes source
  • Guarantee regular MPW shuttles not only for advanced CMOS but also for diverse technology families like BCD, high-voltage SOI, GaN/GaN-on-SOI, and SiC with at least two academic shuttle runs per year per technology family.

    Chips Act 2 should guarantee regular MPW shuttles not only for advanced CMOS, but also for BCD, high-voltage SOI, GaN/GaN-on-SOI, SiC, and other special technologies that are essential for power electronics and mixed-signal research. At least two academic shuttle runs per year per technology family would greatly improve planning and research continuity.

  • Reduce prototyping costs to approach near-zero levels available in Taiwan, Korea, and China to enable academics to test unconventional and high-risk ideas.

    Prototyping costs must be reduced to approach the near-zero levels available in Taiwan, Korea, and China, allowing academics to test unconventional and high-risk ideas.

  • Provide strengthened support for EDA tools and design infrastructure to train future semiconductor engineers and reduce barriers for university labs.

    Strengthened support for EDA tools and design infrastructure is needed to train future semiconductor engineers and reduce barriers for university labs.

• University of Modena and Reggio Emilia (UNIMORE) Academic or research institution, ITA model reads as: supports source
  • Ensure continued funding for the Europractice platform to maintain affordable access to semiconductor services and infrastructure for academic institutions.

    Another important asset that (partially) receives funding from the Chips Act is the Europractice platform, that allows access to many services related to semiconductors such as wafer runs by many different EU institutions, and simulation softwares at sustainable prices.

  • Maintain the Chips JU's competitive call mechanism as a pathway for academic institutions to participate in semiconductor research projects.

    For instance, through the Chips JU it is possible to participate to competitive calls for research projects devoted to strengthen the EU position in the semiconductor strategic industry.

• Fraunhofer IZM Academic or research institution, DEU model reads as: supports source
  • Deepen industrial stakeholder involvement and create faster pathways from research to market-ready solutions.

    To do so, the next phase must deepen the involvement of industrial stakeholders and create faster, more effective pathways from research to application.

  • Ensure pilot lines have operational capacity and mandate to rapidly elevate technology readiness levels and enable knowledge transfer to industrial users.

    Chips Act 2 can catalyze this transformation by ensuring that pilot lines have the operational capacity and mandate to rapidly elevate TRLs, enabling seamless knowledge and technology transfer to industrial users.

• University of Catania - Italy Academic or research institution, ITA model reads as: wants changes source
  • Increase the number of full-time and part-time academic positions, including professors, researchers, and PhD grants to address talent shortages.

    These could include increasing the number of full-time and part-time academic positions (professors, researchers, and PhD grants)

  • Launch media campaigns and educational content including short videos and a TV series to raise awareness of semiconductor engineering careers.

    Short educational videos, media campaigns, and even a brief TV series dedicated to semiconductor engineering could significantly raise awareness and attract young people to this strategically important discipline.

  • Provide dedicated funding for summer schools in electrical and electronic engineering for high-school students.

    Additionally, dedicated funding for summer schools in electrical and electronic engineering for high-school students would be a highly effective way to engage early talent and spark interest in semiconductor technology at a formative stage.

• University of Padova Academic or research institution, ITA model reads as: supports source
  • Expand access to advanced technology nodes for academic institutions.

    expanding access to advanced technology nodes

  • Secure long-term funding to enable sustained academic participation in microelectronics initiatives.

    securing long-term funding for academic participation

  • Strengthen support for small prototyping volumes which are indispensable for research and education.

    strengthening support for small prototyping volumes, which are indispensable for research and education

• Global Electronics Association Business association, BEL; register: Trade and business associations model reads as: wants changes source
  • Expand the Chips Act scope to cover the broader supply chain including Printed Circuit Boards, Printed Circuit Board Assemblies, system integration, and advanced electronics packaging projects.

    we recommend that the Chips Act scope be expanded to cover the broader supply chain, including Printed Circuit Boards (PCBs), Printed Circuit Board Assemblies (PCBAs) and system integration, along with advanced electronics packaging projects.

  • Develop a broader electronics industrial strategy that extends beyond the limited semiconductor focus of the current Chips Act.

    our Association has repeatedly highlighted grave concern about the limited scope of the Chips Act and called for a broader electronics industrial strategy.

• Lund Univeristy Academic or research institution, SWE model reads as: supports source
  • Establish support for workforce development in semiconductor clean room techniques and characterization technology.

    there is an urgent need for a skilled workforce of technicians, engineers, and scientists familiar with clean room techniques and with semiconductor characterization and production technology.

  • Ensure the framework provides access to equipment and competence for start-ups, institutes, and established firms to develop semiconductor innovations.

    Europe also needs to provide access to the equipment and the competence sought by various stakeholders start-up companies, institutes as well as established firms to develop innovations from idea to market

  • Support Lund University's proposal to host an integrated Research & Training Centre and Pilot line focused on Compound Semiconductors.

    Lund University has the capacity and ambition to host an integrated Research & Training Centre and Pilot line that addresses these needs within the specific area of Compound Semiconductors.

• Cistelaier SPA Company, ITA model reads as: wants changes source
  • Formally recognize PCB and PCBA manufacturing, together with associated materials and production equipment, as strategic assets under the Chips Act 2.

    the Commission is strongly encouraged to formally recognize PCB and PCBA manufacturing, together with the associated materials and production equipment, as strategic assets

  • Allocate dedicated funding and develop an industrial policy for the PCB and PCBA value chain.

    to allocate dedicated funding and to promote an industrial policy consistent with Europes wider technological sovereignty ambitions

  • Broaden the Chips Act focus from silicon-centric support to include the entire electronic ecosystem encompassing PCB and PCBA production.

    The European policy must evolve from supporting the silicon-centric phase of the value chain to recognizing and strengthening the entire ecosystem that makes semiconductor functionality available in sophisticated electronic systems

• German Association of the Automotive Industry (VDA) Business association, DEU; register: Trade and business associations model reads as: wants changes source
  • Consider the needs of key user industries, especially automotive and industrial manufacturers, and focus on European core competencies in the Chips Act 2.0.

    Consideration of user industries and a focus on European core competencies is crucial to building a resilient semiconductor economy and securing the future of the automotive industry.

  • Create better framework conditions including faster approval processes, competitive energy prices, and a strategic focus on automotive, industrial, IoT, and power semiconductors.

    In addition to financial support, it will be necessary to create better framework conditions such as faster approval processes, competitive energy prices, a strong talent base, and a clear strategic focus on European strengths - automotive, industrial applications, IoT, and power semiconductors.

  • Adopt a more realistic, demand-driven, and accelerated approach with clear interim milestones for the Chips Act 2.0.

    The Chips Act 2.0 requires a more realistic, demand-driven, and accelerated approach.

• INVENTEC PERFORMANCE CHEMICALS Company, FRA model reads as: wants changes source
  • Extend Chips Act 2 to actively support R&D, industrial deployment and qualification of advanced materials and processes across the semiconductor value chain.

    To achieve these goals, the Chips Act 2 should actively support R&D, industrial deployment and qualification of advanced materials and processes from low-TRL research to pilot lines and full-scale manufacturing.

  • Support European development of PFAS-free, recyclable alternatives for cleaning and cooling processes in semiconductor production.

    Supporting European companies in developing PFAS-free, recyclable and low-impact alternatives would significantly reduce the environmental footprint of semiconductor production while positioning Europe ahead of tightening global regulations.

  • Promote stronger collaboration between local industries, RTOs, public research, start-ups, SMEs and mid-caps in design, advanced chemistry, assembly and thermal management.

    This includes promoting stronger collaboration between local industries, RTOs, public research, start-ups, SMEs and mid-caps, particularly in design, advanced chemistry, assembly and thermal management.

• KSG GmbH Company, DEU model reads as: wants changes source
  • Expand the scope of the Chips Act from silicon to include PCB and PCBA manufacturing as strategic priorities with dedicated funding instruments.

    Expanding the scope from silicon to complete systems: explicitly recognising PCB and PCBA manufacturing as strategic priorities, supported by dedicated funding instruments.

  • Create targeted incentives for European PCB and PCBA capacities including minimum European content requirements and public support for building and maintaining production capabilities.

    Creating targeted incentives to strengthen European PCB and PCBA capacities, including minimum European content requirements and public support for building and maintaining production capabilities.

  • Require PCBs that are manufactured and assembled in Europe for all safety- and security-critical applications and infrastructures.

    Requiring PCBs that are manufactured and assembled in Europe for all safety- and security-critical applications and infrastructures not only to reduce strategic dependencies, but also to safeguard the essential industrial know-how that would otherwise be lost.

• Kalray Company, FRA; register: Companies & groups model reads as: wants changes source
  • Formally recognize fabless companies as the cornerstone of a sovereign semiconductor ecosystem with tailored policies across the value chain.

    Recommendation 1: Formally recognize fabless companies as the cornerstone of a sovereign semiconductor ecosystem, with policies tailored to their distinct needs across the value chain.

  • Provide targeted R&D support through subsidies, tax incentives, or matched funding to European fabless companies, particularly innovative SMEs.

    Recommendation 2: Provide targeted R&D supportthrough subsidies, tax incentives, or matched fundingto European fabless companies, particularly innovative SMEs, enabling them to develop sovereign design capabilities and secure a greater share of the value chain, in line with the Draghi reports recommendations.

  • Establish procurement preferences for EU-produced chips in public data centers and HPC infrastructures to create sustainable market opportunities.

    Recommendation 3 (inspired by the Draghi report and aligned with Eurostack): Establish procurement preferences for EU-produced chips in public data centers and HPC infrastructures, ensuring that public investments translate into sustainable market opportunities for European companies and reinforce the continents strategic autonomy in AI hardware.

• Elviaelectronics Company, FRA model reads as: supports source
  • Include Printed Circuit Boards (PCBs) and Printed Circuit Board Assemblies (PCBAs) as well as their suppliers in the Chips Act 2.0 framework.

    Both of them are of dramatic interest and must be part of the Chips Act 2.0 as well as their contributors such as suppliers of materials, specific consumables and others.

  • Recognize PCBs as essential infrastructure for sovereign European capacity in defense and aerospace sectors.

    For example, delivery of high reliable sub-systems and systems to the defense and aero-space domains implies a strong and full ecosystem for a sovereign Europe and PCBs are a pillar of this ecosystem.

  • Treat inclusion of PCBs and PCBAs in the Chips Act 2.0 as a prerequisite for European independence and long-term systemic strength.

    Including both PCBs and PCBAs into a Chips Act 2.0 appears as a pre-request for a more independent and a stronger European system acting now and for the future.

• Eaton Company, IRL model reads as: supports source
  • Continue and expand funding for collaborative research projects that enable industry, academia, and SMEs to co-develop innovative semiconductor solutions.

    We advocate for continued and expanded funding for collaborative research projects, enabling industry, academia, and SMEs to co-develop innovative semiconductor solutions.

• CERN, the European Organization for Nuclear Research Academic or research institution, CHE model reads as: supports source
  • Ensure that ChipsJU pilot lines, design platforms, and access to advanced semiconductor technologies remain available to European research institutes.

    Chips Act initiatives, such as the ChipsJU pilot lines and design platforms, offer European researchers and institutes access to state-of-the-art deep-submicron processes and advanced packaging and 3D silicon integration technologies.

  • Enhance access to state-of-the-art microelectronics EDA tools for European researchers and engineers designing custom semiconductor components.

    ChipsJU can enhance the access to state-of-the-art microelectronics EDA tools, enabling European researchers and engineers to efficiently design and optimise the complex custom components for net-generation particle physics instruments.

  • Support the development of custom microelectronic components for particle physics detector applications through the Chips Act framework.

    For CERN, this framework could provide direct support for the development of custom microelectronic components required by its particle-physics detectors.

• Istituto Nazionale di Fisica Nucleare (INFN) Academic or research institution, ITA model reads as: wants changes source
  • Further intensify efforts to attract, educate, and retain semiconductor professionals with emphasis on bridging the gap between academic training and industrial practice.

    Efforts to attract, educate, and retain talent must be further intensified, with special attention to mechanisms that effectively bridge the gap between academic training and industrial practice.

  • Support organizations that provide practical, hands-on experience across full design cycles to accelerate workforce development in semiconductor integrated-circuit design.

    By offering hands-on experience across full design cycles, these organizations can significantly accelerate workforce development, strengthen Europes semiconductor capabilities, and ensure that the objectives of the European Chips Act translate into long-term, sustainable impact.

• OHB System AG Company, DEU model reads as: supports source
  • Include PCB production and population in the Chips Act 2.0 funding, standards development and collaborative initiatives.

    For Europe to maintain leadership in space, defense and critical infrastructure, PCB and EMS is recommended to be included in funding, standards development and collaborative initiatives under Chips Act 2.0.

  • Enhance PCB and EMS capabilities to secure Europe's entire electronics value chain and strengthen resilience against supply chain disruptions.

    By enhancing PCB and EMS capabilities, Europe can secure its entire electronics value chain and strengthen resilience.

  • Recognize that PCB and EMS capabilities are vital for critical applications in space, defense and infrastructure systems.

    This capability is vital for space applications, where satellites demand high-reliability PCBs and EMS processes. It is also crucial for defense systems, ensuring operational sovereignty and preventing foreign interference in mission-critical technologies.

• NANO-electronic - UiO Academic or research institution, NOR model reads as: supports source
  • Continue providing access to state-of-the-art semiconductor tools and technology for research institutions.

    we utilize the options and opportunities offered through, among other the EUROPRACTICE project to get access to state-of-the-art tools and technology

  • Support initiatives that enable research institutions to participate in Chips-JU funded competence centers.

    initiatives like this enable us to be a part of the Chips-JU funded Norwegian competence center CC-Norchip to further support the goals of the Chips Act

  • Recognize research institutions' important role in supplying skilled candidates and research to support the semiconductor industry.

    it will enable us to continue to be a relevant partner in research and fulfilling our social mission of supplying relevant research to society and supplying relevant candidates to industry and public service

• Centre for Future Generations NGO, BEL; register: Think tanks and research institutions model reads as: wants changes source
  • Replace the 20% volume target with a strategic portfolio approach focused on protecting existing strengths in lithography equipment and optics while backing emerging technologies.

    Replace the 20% volume target with a strategic portfolio approach: protect existing strengths in lithography equipment (ASML), precision optics (Zeiss), and research infrastructure (imec); back emerging technologies where Europe can establish future leverage; and reduce critical dependencies selectively, focusing on automotive and edge inference chips rather than comprehensive manufacturing autonomy.

  • Establish a Strategic Semiconductor Asset designation for entities at critical chokepoints with tailored support including extended state-aid flexibility, fast-track permitting, and streamlined Commission communication.

    The revised Act should establish a Strategic Semiconductor Asset designation for entities at critical chokepoints, triggering tailored support including extended state-aid flexibility, STEP integration, fast-track permitting, and streamlined communication with the Commission.

  • Coordinate export control decisions at EU level and develop a calibrated response framework with retaliatory measures against third countries restricting Europe's chip access.

    The revised Act should coordinate export control decisions at EU level and develop a calibrated response framework; a menu of retaliatory measures that Europe could deploy if third countries restrict Europes access to chips.

• Trinity College Dublin Academic or research institution, IRL model reads as: wants changes source
  • Avoid directing most public funding toward large industrial actors while strengthening foundational layers including design tools, research infrastructure, and skills development.

    Europes semiconductor strategy must avoid the risk of directing most public funding toward large industrial actors while neglecting the foundational layers of the ecosystem, i.e. design tools, early-stage research infrastructure, and the skills pipeline.

  • Address strategic dependence on non-EU Electronic Design Automation tools and invest in European alternatives to avoid remaining dependent on external licensed toolflows.

    If Europe rebuilds manufacturing capacity on top of external, licensed, and often opaque toolflows, it will remain strategically dependent even after investing billions in fabrication capacity.

  • Elevate hardware security to a core objective of the Chips Act with substantial investment in hardware assurance, open verification platforms, and secure-by-design methodologies.

    In parallel, hardware security must be elevated to a core objective of the Chips Act.

• Micro company, GBR NGO, GBR model reads as: wants changes source
  • Invest more in open source as part of the EU Chips Act 2.0.

    EU Chips act 2.0 should invest more in open source

  • Lower the barrier of entry to chip design to enable innovative European SMEs.

    to lower the barrier of entry to chip design in order to enable innovative European SMEs

  • Reduce reliance on non-European proprietary software that is critical for chip development.

    to reduce reliance on non-european proprietary software that is critical for chip development today

• Fraunhofer IPMS Academic or research institution, DEU model reads as: wants changes source
  • Shift Chips Act 2 focus from CAPEX to OPEX funding to activate research equipment investments made under Chips Act 1.

    A future Chips Act 2 should focuse on OPEX funding in order to activate the invests in the equipment for research and innovation which was purchased in Chips Act 1.

  • Prioritize critical value chain issues and advanced technologies over production number targets.

    The future EU strategy within Chips Act 2 should not only focus on production numbers (20% target) but even more on critical issues in the world wide semiconductor value chains. This must include advanced packaging and system aspects.

  • Increase flexibility in cost eligibility rules to address overhead problems affecting equipped R&D organizations.

    Additionally, we need more flexibilty in the eligibility of costs.

• Axis Communications Company, SWE model reads as: wants changes source
  • The EU must support a functioning talent market with cross-border mobility and education aligned with industry needs, with focus on digital system design and ASIC/IP development.

    To strengthen long-term capabilities, the EU must support a functioning talent market with cross-border mobility and education aligned with industry needs. The focus should remain on digital system designincluding ASIC and IP developmentwhere Europe already demonstrates strong expertise.

  • The EU should prioritize development of reusable EU-developed IP building blocks and European EDA tools to reduce dependency on non-European actors.

    To reduce dependency on non-European actors, the EU should prioritize the development of: - Reusable, EU-developed IP building blocks (e.g., CPUs, NPUs/AI accelerators) - European EDA tools, which are central to every stage of chip development

• Lace Lithography AS Company, NOR model reads as: wants changes source
  • Create targeted, flexible funding programs for semiconductor equipment manufacturers with smaller calls that do not require large consortiums or predefined commitments that exclude SMEs.

    With targeted we mean smaller, flexible calls which do not require large consortiums with predefined commitments which is effectively excluding SMEs from defining and leading the projects

  • Fund access and testing of prototype semiconductor equipment in the pilot fab lines that will be established under the act.

    (2) fund access and testing of their prototype equipment in the pilot fab lines which will be established under the act.

  • Recognize semiconductor equipment manufacturing as a critical sector where Europe has an irreplaceable role in the global chip ecosystem and as one of Europe's remaining tech monopolies.

    In general, semiconductor equipment manufacturing is the only place in the global chip manufacturing ecosystem that Europe plays an irreplaceable role - and lithography is one of Europe's last tech monopolies.

• HENSOLDT AG Company, DEU model reads as: wants changes source
  • Ensure ITAR-free access to custom designs in less advanced technologies like 22nm to support European defense applications.

    It is crucial that we have ITAR-free access to these technologies, also for lower volumes in Europe to support defence applications.

  • Ensure availability of more advanced CMOS nodes and corresponding design houses providing products like AI, FPGAs, and CPUs in Europe.

    The availability of more advanced CMOS nodes and corresponding design houses that provide products (e.g., AI, FPGAs, CPUs) in Europe is essential.

  • Include the defence industry in EU Chips Act funding opportunities rather than excluding them as with ChipsJU.

    It is vital that the EU Chips Act does not exclude the defence industry from funding opportunities, as seen with ChipsJU.

• SPARC FOUNDRY Company, ESP model reads as: wants changes source
  • Recognise photonics and III-V technologies as a strategic pillar and establish a European network of open-access Photonic and Hybrid Foundries.

    Recognise photonics and III-V technologies as a central pillar of strategic autonomy, with a specific programme to create and strengthen a European network of open-access Photonic and Hybrid Foundries.

    machine translation by the Commission, original in ES
  • Close the gap between piloting and industrialisation through dedicated FOAK instruments, co-financing mechanisms, public-private risk-sharing, and simplified procedures.

    Close the gap between piloting and industrialisation through a FOAK pillar with dedicated instruments to co-finance CAPEX and OPEX for first industrial lines (including specialised medium-sized facilities), public-private risk-sharing mechanisms and simplified procedures for aid and authorisations at European level.

    machine translation by the Commission, original in ES
  • Create a specific European category of open-access specialised Foundry for critical technologies with its own State aid framework and priority access to European instruments.

    Create a specific European category of open-access specialised Foundry for critical technologies (photonics, III-V, power, advanced sensors), with its own State aid framework and priority access to European instruments.

    machine translation by the Commission, original in ES
• Forschungszentrum Jülich GmbH Academic or research institution, DEU; register: Think tanks and research institutions model reads as: wants changes source
  • Give greater attention to emerging AI principles based on neuromorphic computing and novel devices in the Chips Act 2.0 framework.

    For the next generation of AI, it is essential to give greater attention to the emerging principles already present in scientific research, including the utilization of novel devices, such as those based on neuromorphic computing.

  • Ensure adequate representation of the scientific community in future European initiatives like ChipsJU.

    it is crucial that they are adequately represented in future European initiatives like ChipsJU to ensure European sovereignty in this field.

  • Create a coherent framework in Chips Act 2.0 that reinforces and complements quantum chip development initiatives.

    it is crucial that Chips Act 2.0 both reinforces and complements these initiatives, creating a coherent framework that accelerates quantum-hardware development from research through to industrialization.

• CLEPA - European Association of Automotive Suppliers Business association, BEL; register: Trade and business associations model reads as: wants changes source
  • Pillar I must translate research programmes into producible technologies for industrial-scale deployment that directly address automotive industry requirements.

    To be effective, Pillar I must translate development programmes into producible technologies and directly address the requirements of European downstream industries as the automotive industry.

  • Introduce operational expenditure support for backend operations, advanced packaging, testing, and assembly through targeted revision of state aid rules.

    Operational expenditure support for backend activities is essential to enable industrial-scale deployment and ensure that Europe can meet automotive and broader industrial demand.

  • Replace Pillar III's passive data collection with proactive, continuous real-time dialogue between industry and the Commission on geopolitical risks and supply chain disruptions.

    Pillar III should replace passive data collection with proactive, continuous dialogue between industry and the Commission.

• Qualcomm Company, USA; register: Companies & groups model reads as: wants changes source
  • Complement manufacturing production goals with innovation-oriented indicators including design capability, R&D intensity, advanced packaging, IP generation, and skilled workforce development.

    Therefore, Europe should therefore complement production goals with innovation-oriented indicators, including design capability, R&D intensity, advanced packaging, IP generation, skilled workforce development, and leadership in AI, 5G/6G, edge computing and energy-efficient low-power processing.

  • Broaden eligibility and support to under-supported vital segments such as chip design, IP, EDA tools, advanced packaging, materials, equipment, and fabless companies.

    Europe has under-supported vital segments such as chip design, IP, EDA tools, advanced packaging, materials, equipment, and fabless companies.

  • Reinforce the European Semiconductor Board's role to coordinate strategy, permitting, and funding at EU level.

    The role of the European Semiconductor Board should be reinforced, enabling it to coordinate strategy, permitting, and funding at EU level.

• Micro company, FIN Business association, FIN model reads as: wants changes source
  • Recognize photonics as a core pillar of the semiconductor ecosystem and include it within the Chips Act framework.

    To remain competitive, the EU must recognize photonics as a core pillar of the semiconductor ecosystem.

  • Establish geographically distributed pilot lines for photonics to serve SMEs and start-ups in clusters outside capital regions.

    To fully unlock this distributed expertise, pilot lines for photonics should also be geographically distributed.

  • Fill specific gaps in pilot line coverage for photonic applications including PICs for quantum, polymers, antimonide-based materials, specialty fibers, and solution-based solar cells.

    There are several critical gaps in existing pilot line coverage that need to be filled: Photonic Integrated Circuits (PICs) for quantum computing, communication, and sensing. Polymers as a cost-efficient and lightweight material platform, especially important for defense. Antimonide (Sb)-based materials for mid-infrared applications, including epitaxy, lasers, and detectors. Glass and specialty fibers for advanced photonic integration, interconnections, and light control. Solution-based solar cells for soft, flexible, and low-cost renewable energy technologies.

• RECENDT - Research Center for Non-Destructive Testing GmbH Academic or research institution, AUT; register: Think tanks and research institutions model reads as: wants changes source
  • Establish dedicated budget streams reserved for research and technology organizations to implement and demonstrate novel supporting and enabling technologies in fabrication facilities.

    There should be dedicated budget streams reserved to invite RTOs to implement and demonstrate novel supporting- & enabling-technologies in the fab.

  • Enable the transfer from laboratory to fabrication environments for photonic metrology, testing, monitoring, sensing and characterization technologies at wafer-level and chip-level.

    Especially, the transfer from lab to fab shall be enabled for photonic metrology, testing, monitoring, sensing and characterization technologies - for wafer-level processes or for chip-level structures.

  • Implement appropriate funding instruments to support semiconductor metrology demand for high aspect ratio structures, ultra-thin films and 3D-stacks.

    We noticed an increasing demand in semiconductor metrology in general and in particular for high aspect ratio structures, ultra-thin films and 3D-stacks. However, no appropriate funding instruments were implemented in the last Chips Act.

• CSEM Academic or research institution, CHE model reads as: wants changes source
  • Open topic calls should remain for both RIA and IA, with focus topic calls opened at least 6 months before the deadline.

    Open topic calls should remain for both RIA & IA. In case focus topic calls will be launched they should be opened 6months before the deadline (3 months is not enough).

  • Lab2Fab kind of initiatives should be open to associated states.

    Lab2Fab kind of initiatives should be open also for associated states.

  • Sustainability aspects including PFAS, repairability, ultra-low energy, and reuse should be present in the framework.

    Sustainability should be present (PFAS, repairability, ultra-low energy, reuse...).

• CSEM Academic or research institution, CHE model reads as: wants changes source
  • Prioritize innovative chip technologies where Europe has clear competitive advantages, such as novel photonic chips.

    We need more focus on innovative chip technologies in which Europe has a clear advantage (for example novel photonic chips, not based on silicon).

  • Reduce focus on chip technologies where Europe is merely attempting to catch-up to far-ahead competitors.

    Less focus on chip technologies in which Europe would only be attempting to catch-up to others far ahead.

  • Develop a stronger venture capital market to ensure high-potential companies remain under European ownership.

    Without a stronger financial market to provide venture capital, truly high-potential, disruptive companies and technologies will continue to end up in ownership outside of Europe.

• Micro company, FRA Company, FRA model reads as: wants changes source
  • Prioritize packaging, assembly, and test as core elements of EU semiconductor strategic autonomy, not just chip design and fabrication.

    EU RESHORE, EU Strategic autonomy, EU Sovereignty for Packaging, assembly and Test is a MUST and a TOP PRIORITY.

  • Listen to industry input directly or via the 3As rather than relying primarily on RTO recommendations.

    Listen to industry says (directly or via the 3As), not only RTOs "wet dreams"

  • Change the Joint Undertaking voting rules to equal representation with one-third each for EC, PAB, and PMB.

    Change the voting rules of the JU to 1/3rd each EC, PAB, PMB

• Micro company, AUT Company, AUT model reads as: wants changes source
  • Adopt a business-driven innovation model rather than Europe's predominantly research-driven approach for semiconductor development.

    A business-driven innovation model, in contrast to Europes predominantly research-driven approach.

  • Replace consultancy-based support with direct hands-on technical assistance and co-development support for SMEs.

    Remove all consultancy based support/program. This middle man just do bla-bla and ask SME to do the job. instead they should support and do work with SME, offering hands-on technical assistance, co-development, and practical implementation support.

  • Establish a unified umbrella framework to consolidate fragmented semiconductor clusters and coordinate all related services and funding.

    A single, transparent umbrella framework (like amazon.com for shopping) should be established to coordinate all semiconductor-related services, funding access, and networking activities.

• Semidynamics Company, ITA model reads as: wants changes source
  • The EU should promote and support a thriving open source ecosystem for EDA design software.

    EU should push for a thriving open source ecosystem where software for EDA design does not represent a barrier as today

  • Address market concentration in EDA software by reducing EU companies' dependence on a small number of dominant vendors.

    currently EU companies are virtually obliged to purchase from only 3 big companies

  • Recognize EDA software as a critical component of the semiconductor ecosystem that requires specific policy attention.

    EDA software is a vital part of the ecosystem

• CIMULEC Group Company, FRA model reads as: wants changes source
  • Integrate PCBs and PCBAs into the scope of the European Chip Act 2.

    It is imperative to integrate PCB and PCBA into the European Chip Act 2 if we do not want to move along with the objective of strengthening our electronic independence.

    machine translation by the Commission, original in FR
  • Recognize PCBs as critical links in the semiconductor and electronics value chain.

    PCBs are one of the most critical links.

    machine translation by the Commission, original in FR
  • Prevent the shift of PCB and PCBA manufacturing to Asia as has occurred with other industries.

    This strategy, which we have seen on telephony or solar panels that are now almost entirely manufactured in Asia, is likely to be repeated.

    machine translation by the Commission, original in FR
• Politecnico di Torino Academic or research institution, ITA model reads as: wants changes source
  • Chips Act 2 should focus on reinvigorating IC design capability in addition to semiconductor production capability.

    The effort of Chips Act 2 should focus not only on semiconductor production capability but also on reinvigorating the design capability.

  • Promote the IC designer profession to younger generations starting from high school to encourage enrollment in related university courses.

    This requires an effort towards younger generations (high-schoolers and below) to promote the profession of integrated circuit (IC) designer so that they enroll in the right courses at university level and learn how to design a chip.

  • Ensure European universities maintain access to IC design tools and production at discounted rates via the Europractice initiative.

    This also requires continuing giving the European universities access to IC design tools and IC production at discounted rates via the Europractice initiative

• FHNW Academic or research institution, CHE model reads as: wants changes source
  • Ensure smaller universities, SMEs and regional centres have direct, fair access to design tools, pilot lines, prototyping and collaborative projects without needing to be filtered exclusively through large RTOs.

    Chips Act 2 should therefore ensure that smaller universities, SMEs and regional centres have direct, fair access to design tools, pilot lines, prototyping and collaborative projects without needing to be filtered exclusively through large RTOs.

  • Attach clear expectations for cooperation with the wider education and innovation landscape to public investment in major industrial facilities.

    Public investment in major industrial facilities should be accompanied by clear expectations for cooperation with the wider education and innovation landscape.

  • Ensure capacity building is genuinely distributed across regions and that opportunities for hands-on participation reach every part of the continent.

    Europe will only achieve technological sovereignty if capacity building is genuinely distributed and if opportunities for hands-on participation reach every part of the continent.

• Ulster University Academic or research institution, GBR model reads as: wants changes source
  • Include dedicated provisions for industry-aligned chip design training programmes and academia-industry collaborative initiatives.

    The Chips Act should include dedicated provisions for industry-aligned training programmes that equip professionals and researchers with practical chip design expertise, as well as collaborative initiatives between academia and industry to ensure training reflects current technological demands.

  • Establish a dedicated funding scheme covering fabrication costs, testing, multi-project wafer access, and post-fabrication analysis for prototype and experimental chips.

    I strongly advocate for the inclusion of a dedicated scheme within the revised Chips Act that specifically covers fabrication costs for prototype and experimental chips, testing and characterisation expenses, multi-project wafer access, and post-fabrication analysis and evaluation.

  • Expand and institutionalize the IHP Open PDK pilot programme as a model within the revised Chips Act.

    The IHP Open PDK pilot programme has demonstrated a successful model that should be expanded and institutionalised within the Chips Act.

• Micro company, BEL Business association, BEL model reads as: wants changes source
  • Strengthen the role of SMEs and startups in the semiconductor ecosystem as essential contributors to European revival.

    At ChipsWIN (the Walloon Chips Competence Centre), we think that SME's and startups are an essential part in reviving the semiconductors in Europe.

  • Address the high financial and investment thresholds that currently prevent SMEs and startups from bringing innovations to market.

    In our consultations we have seen that SME's and startups experience high (financial / investments) thresholds when wanting to bring an innovation to the market.

  • Establish access to shared infrastructures enabling SMEs and startups to conduct proprietary processing and testing at limited cost.

    Access to shared infrastructures allowing SME's or startups to run proprietary processing or testing for a time at a limited cost is seen as an important enabler.

• European Space Agency Other, NLD model reads as: wants changes source
  • ESA and ESCC roadmaps and priorities for space microchips should be taken into account by the Chips JU and EU Chips Act 2.0.

    it would be great if ESA and ESCC roadmaps, needs and priorities for space microchips would be taken into account by the Chips JU and the new in the making EU Chips Act 2.0

  • The act should allocate more resources to support the special needs of microchips for the space sector in Europe.

    put more resources into all the space microelectronics goals mentioned above, helping to cover the special needs of the microchips for the SPACE sector in Europe

  • The act should support the specific microelectronics technology areas that the European space community requires.

    The main microelectronics technology areas where the European space community (agencies, fabless-vendors, manufacturers, industry) would much appreciate support from the EU Chips Act 1.0 and 2.0:

• FabCat NGO, ESP model reads as: wants changes source
  • Create the European Network of Semiconductor Resilience and Skills Fabs (ERSFabs) with approximately six mid-sized foundries across Member States.

    We propose the creation of the **European Network of Semiconductor Resilience and Skills Fabs (ERSFabs)**.

  • Address the critical gap in mature nodes (22nm - 130nm) resilience for strategic sectors including Automotive, IoT, Defence, and Health.

    a critical gap remains in the resilience of **mature nodes (22nm - 130nm)**, which are essential for Europe's strategic sectors

  • Establish advanced training academies within the foundries to bridge Europe's skilled workforce gap in semiconductors.

    These facilities will serve a dual purpose: guaranteeing **strategic resilience production** of mature nodes during crises and acting as **advanced training academies** (Skills Fabs) to bridge the talent gap.

• Micro company, FRA Company, FRA model reads as: wants changes source
  • Chip Act 2 should target the whole ecosystem, not only the large upstream companies involved in the semiconductor conversion process.

    this evolution should target the whole eco-system and not only the large upstream companies involved in the semiconductor conversion process.

  • A mapping of the European electronics industry should be carried out to identify which sectors are most dependent on non-European industries.

    A mapping of the European electronics industry should be carried out in order to identify which sectors of the industries are the most dependent on non-European industries.

  • End-users should be involved in the initiative to validate the relevancy of technical solutions supported by EU.

    End-users should be involved in such initiative since they own the performance requirements and thus are able to validate the relevancy of the technical solutions supported by EU considering the fast pace at which electronic products are developed.

87 more analysed submissions on the consultation page.